用于不锈钢薄板切割的直接半导体激光源

摘要

针对高功率半导体激光器存在的光束质量差、单元功率低的缺点,利用合束技术来提高激光功率及光束质量,配合QBH光纤前端帽优化聚焦镜以实现高效耦合。采用11个条宽5.4 mm的迷你线阵合束,通过光束整形、空间合束、偏振合束和波长合束,聚焦耦合进200μm/0.2光纤。在50 A电流下,实现连续386 W输出,功率密度为1.23 MW/cm2,电光效率为43.6%。在200 W的功率下,该激光器可以切割厚度为1 mm的不锈钢薄板。%11 mini-bars with a width of 5 . 4 mm were coupled into a 200 μm/0 . 2 QBH fiber by beam shaping, spatial overlapping, polarization multiplexing, and wavelength multiplexing. The di-ode laser source with a continuous wavelength power of 386 W, a power density of 1. 23 MW/cm2 and the electro-optical (E-O) efficiency of 43. 6% at 50 A emitting from the fiber is developed. This laser source has been employed to directly cut the stainless sheet with the thickness of 1 mm at the output power of 200 W.