首页> 中文期刊> 《林产工业》 >木质导热材料的导热性能及强化导热机理研究

木质导热材料的导热性能及强化导热机理研究

         

摘要

为减少地热供暖过程中的能源损耗,提高传热效率,开展木质导热材料的强化导热机理及性能研究.该研究以木质材料为主要原料,碳素材料为导热材料,采用纳米发热技术和人造板制造技术相结合的工艺制备导热木质复合材料,重点研究木质导热材料的工艺优化,强化导热机理及材料导热性能.研究表明:1)当石墨填充量15%、石墨粒径2 500目、偶联剂为钛酸酯时制备的导热材料其各项力学性能指标均达到国标GB/T 11718-2009《中密度纤维板》的要求.2)最优工艺条件下材料的导热系数为0.266 W/(m·K),与普通木质复合材料的导热系数0.045 W/(m· K)相比,增大了约5倍左右.3)相同热流量的条件下,热量传递至普通木质材料表面温度为41.5℃;传递到导热材料温度为47.95℃.因此,导热材料较普通材料的导热性能有明显的提高.%In order to reduce loss of energy and improve the efficiency of heat transfer in the process of geothermal heating,heat conduction wood materials were studied.The wood was the main raw materials,carbon materials were strengthening thermally conductive material,and thermally conductive wood materials were prepared by nano-technology and wood-based panel technology.Main research focus on process optimization,enhanced heat conduction mechanism and thermal conductivity.Research result indicates:1) Process optimization result are the amount of 15% graphite filler,2 500 mesh size graphite particle and titanate coupling agents,all mechanical properties are up to GB / T 11718-2009 requirements.2) Thermal conductivity of thermally conductive wood material is 0.266 W/(m · K),but the thermal conductivity of ordinary material is 0.045 W / (m · K).It is about five times to the thermal conductivity of ordinary material.3) The same thickness plate,the same heat flow conditions,heat transfer to the surface,the general wood surface temperature is 41.5 ℃,the thermal material temperature is 47.95 ℃.Therefore,the thermal conductivity of thermal conductive materials is significantly improved compared with that of ordinary materials.

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