Cool down computer chips with liquid metal device driven by the heat of chips

摘要

With the soaring advances in computational speed, thermal management becomes a major concern in computer systems. To remove heat generated by computer chips or very large scale integrated circuits, a research team headed by Prof. LIU Jing with the CAS Technical Institute of Physics and Chemistry in Beijing has developed a novel liquid metal cooling system that can be powered by the very heat produced by computer chips. The feat has been reported by the UK Journal of Physics D: Applied Physics as a cover article.