随着电子芯片功耗不断增大，散热问题已经成为电子设备，特别是大型高密度电子设备发展的瓶颈问题。中国科学院电工研究所自主研发的蒸发冷却技术，其利用冷却介质的相变潜热带走热量，冷却能力较传统风冷等冷却技术有很大优势。其在电子设备上的应用首要问题之一是冷却介质与电力电子器件材料之间的相容性问题。本文详细介绍了蒸发冷却介质与电子设备材料相容性实验研究情况，并对实验结果进行了分析，为蒸发冷却介质与IT设备材料的相容性筛选提供了指导，这将为未来蒸发冷却技术应用于大型电子设备的冷却提供重要技术支撑。%With the development of the electronics and information technology, the heat dissipation problem has be⁃come the development bottleneck of electronic equipment, especially large⁃scale high⁃density electronic devices. E⁃vaporative cooling technology of the Institute of Electrical Engineering, Chinese Academy of Sciences, utilizing phase change latent of cooling medium, cooling capacity has the great advantage than traditional air⁃cooled cooling technology. When it is applied to large electronic equipment cooling, material compatibility is an important prob⁃lem, which requires the first study. This paper describes materials compatibility experimental research and analysis between cooling media and electronic equipment. And the experimental results provide cooling media screening guidance for electronic equipment, which provide important technical support for evaporative cooling technology ap⁃plying to large⁃scale electronic equipment, in future.
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