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Physics-based process modeling, reliability prediction, and design guidelines for flip -chip devices

机译：倒装芯片设备的基于物理的过程建模，可靠性预测和设计指南

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作者
Michaelides, Stylianos;
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作者单位

Georgia Institute of Technology;

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授予单位 Georgia Institute of Technology;
学科
学位 Ph.D.
年度 1999
页码 208 p.
总页数 208
原文格式 PDF
正文语种 eng
中图分类
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1. A process/physics-based compact model for nonclassical CMOS device and circuit design [J] . J.G. Fossum, L. Ge, M.-H. Chiang, Solid-State Electronics . 2004,第6期

机译：非经典CMOS器件和电路设计的基于过程/物理的紧凑模型
2. Design Guidelines and Process Quality Improvement for Treatment of Device Variations in an LSI Chip [J] . Masakazu AOKI, Shin-ichi OHKAWA, Hiroo MASUDA IEICE Transactions on Electronics . 2005,第5期

机译：处理LSI芯片中的设备变化的设计准则和过程质量改进
3. Life-cycle reliability design optimization of high-power DC electromagnetic devices based on time-dependent non-probabilistic convex model process [J] . Ye Xuerong, Chen Hao, Sun Qisen, Microelectronics & Reliability . 2020,第Nova期

机译：基于时间依赖性非概率凸模型过程的高功率直流电磁器件的生命周期可靠性设计优化
4. A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices [C] . Siva Gurrum, Manu Prakuzhy, Guangxu Li, IEEE Electronic Components and Technology Conference . 2018

机译：将热机械可靠性预测集成到带引脚倒装芯片器件的协同设计中的方法
5. Characterization and prediction of material response of micro and nano-underfills for flip chip devices. [D] . Islam, Muhammad Saiful. 2006

机译：倒装芯片器件的微型和纳米底部填充材料的特性表征和预测。
6. Physics-Based Device Models and Progress Review for Active Piezoelectric Semiconductor Devices [O] . Hongseok Oh, Shadi A. Dayeh 2020

机译：基于物理的设备模型和有源压电半导体器件的进度综述
7. Reliability prediction of discrete devices by modeling the process of material degradation [O] . Ольга Віталіївна Кравченко 2015

机译：通过模拟材料劣化过程来实现离散设备的可靠性预测

Physics-based process modeling, reliability prediction, and design guidelines for flip -chip devices

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