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De-embedding Method Comparisons and Physics Based Circuit Model for High Frequency D-Probe

机译:高频D-探针的去嵌入方法比较和基于物理的电路模型

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摘要

In section 1, the procedures of 1X-Reflect smart fixture de-embedding (SFD), 1-port auto fixture removal (AFR), and 2X-Thru SFD are compared from various perspectives: test fixture design, the de-embedding procedure, and de-embedded results. The accuracy of fixture characterization and the de-embedded result is the key figure of merit (FOM) in each de-embedding method. Full wave models are built to evaluate the FOM of the three methods, by comparing the scattering parameters (S-parameters) and time domain reflectometer (TDR). A test coupon for measuring USB-C cables is adopted to serve as a manufactured validation purpose.;In section 2, a physics-based circuit model for a novel differential probe without a nearby ground pin is built up to 20GHz. First, the SFD method is used to obtain the S-parameter of a differential probe in a full wave model to validate the effectiveness of this method. Second, real measurements are made to obtain the S-parameter of a differential probe. Furthermore, the one-to-one corresponding circuit model has been built to understand the physics of probes. A layout for the advance interconnect tool (AITT) demo board is then designed to test probe characteristics and AITT software. Finally, the SFD method is applied to de-embed the test fixtures, and material information is extracted based on the de-embedded results.
机译:在第1节中,从多种角度比较了1X-Reflect智能夹具去嵌入(SFD),1端口自动夹具去除(AFR)和2X-Thru SFD的过程:测试夹具设计,去嵌入过程,和去嵌入结果。夹具表征的准确性和去嵌入的结果是每种去嵌入方法的关键品质因数(FOM)。通过比较散射参数(S参数)和时域反射仪(TDR),构建全波模型来评估三种方法的FOM。采用了用于测量USB-C电缆的测试试样作为制造验证目的。在第2节中,构建了不带附近接地引脚的新型差分探头的基于物理的电路模型,频率高达20GHz。首先,SFD方法用于获得全波模型中差分探头的S参数,以验证该方法的有效性。其次,进行实际测量以获得差分探头的S参数。此外,已经建立了一对一的对应电路模型以了解探针的物理原理。然后设计高级互连工具(AITT)演示板的布局,以测试探针特性和AITT软件。最后,采用SFD方法对测试夹具进行去嵌入,并基于去嵌入的结果提取材料信息。

著录项

  • 作者

    Chen, Yuan.;

  • 作者单位

    Missouri University of Science and Technology.;

  • 授予单位 Missouri University of Science and Technology.;
  • 学科 Electrical engineering.;Engineering.
  • 学位 M.E.
  • 年度 2018
  • 页码 62 p.
  • 总页数 62
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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