Effect of reflow variables on the nanoscale mechanical properties of lead free solders.

摘要

This study presents findings on the nano-mechanical properties of binary and ternary (Cu, Ag) -- Sn Solders. Nanoindentation with a cube corner tip was used on Sn-Ag and SAC405 alloy compositions to investigate the effect of reflow process variables on the properties of hardness and reduced modulus on a nanoscale. The specimens tested were sandwich solder joints where Cu was the substrate. While the reflow variables of cooling rate and reflow time were found to cause changes in IMC morphology and solder matrix microstructure, the nano hardness and reduced modulus were independent of these variables. Low max loads coupled with a cube corner indenter tip yielded interesting load-depth curve results on the solder matrix.