Thermal conductivity of materials for electronic packaging substrates.

摘要

Data on the thermal conductivity of commercially available aluminum nitride substrates, over the temperature range of 20-500 K, is analyzed using the Klemens model. Parameters in this model, which include crystallite size and impurity concentration, are determined through a nonlinear least squares fitting routine. The resulting parameters are compared with values obtained from other experimental techniques such as scanning electron microscopy (SEM) and proton induced x-ray emission (PIXE). The magnitude and temperature of the peak in the thermal conductivity data is observed to be uniquely dependent on the crystallite size and lattice impurity concentration of the specimen. This observation has lead to the development of a graphical technique for the estimation of impurity concentration and crystallite size from low temperature thermal conductivity data.