Implementation of low temperature cofired ceramic packages as a high volume product requires resistor and conductor materials compatible with a tape dielectric. Studies have shown resistor ink materials compatible with LTCC dielectric materials, but do not address the resistor size, placement, or thickness within LTCC packages. This study discusses these using design of experiment techniques to determine which variables have significant effect on resistor performance.;Available 100 ohm/square ink materials were evaluated for resistance, sheet resistivity, and TCR to evaluate electrical performance. The ink material has the greatest effect on the electrical properties with nominal sheet resistivities ranging from 50 to 321 ohms/square.;Experimental results indicate that compatible resistor materials exist for use with LTCC packages. Experimentally determined coefficients for the power common exponential model, R = 10
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