Conjugate heat transfer and concurrent thermal design for electronics cooling applications.

摘要

The physics associated with forced convection in electronics cooling configurations is explored using direct numerical simulations of a representative geometry, termed the grooved channel, with the imposition of both constant heat flux and constant temperature boundary conditions. The significance of conjugate conduction/convection effects is explored by contrasting the thermal characteristics of four package configurations that differ in material composition and concentration of heat generation, but have the same external dimensions as the grooved channel. These simulations are conducted over a range of Reynolds numbers that span the laminar and transitional flow regimes corresponding to streamwise velocities characteristic of electronics cooling applications (0.75 to 1.25 m/s).; Following this fundamental study, a concurrent thermal design methodology for electronic systems will be outlined. This concurrent design methodology makes use of analytical and numerical analyses that grow in completeness with the evolution of a design. Additionally, a case study is presented that involves the wearable electronic device, Navigator. This case study represents a design effort that was carried through to fruition in a multidesigner/multidiscipline environment.; Finally, a new approach to the solution of conjugate conduction/convection phenomena, based upon the method of Reduction of Order proposed by Kantorovich and Krylov (1958), is described and exemplified for conjugate planar Poiseuille flow. In addition, this semi-analytical technique provides a balance between accuracy and time constraints and, as such, would be appropriate as an early design stage tool.