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Characterizing the humidity and thermal environments of commercial avionics for accelerated test tailoring.

机译:表征商用航空电子设备的湿度和热环境,以加快测试剪裁速度。

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摘要

The climatic environments, especially thermal cycling and humidity, have long been recognized as key factors in electronics reliability. Most humidity and thermal cycle accelerated tests are somewhat arbitrarily specified and rarely have demonstrated linkage to the in-service environment. This work proposes a methodology to determine realistic humidity and thermal cycle test requirements based on measured environment data.; To illustrate this approach, environment data from commercial airplanes is measured and applied to specific failure mechanisms. Temperature, relative humidity, pressure, and equipment power condition for more than 1100 flights were measured in the key avionics areas of an operating airplane. The local environment at the failure site is derived using transient assumptions. To reduce irregular field data to a form useable by acceleration transforms, counting algorithms are presented that preserve necessary attributes. The time at discrete humidity and temperature intervals is accumulated. For thermal cycle counting, a three-parameter rain flow method is introduced that preserves time-dependent parameters needed for solder fatigue analysis. Tailoring accelerated tests based on average environment parameters is compared with these damage integration approaches.; Surface-mount technology and plastic encapsulated microcircuits are increasingly used in new avionics designs. These technologies are used as example cases of developing realistic accelerated life tests. Existing and computationally simple acceleration transforms are used to estimate the environmentally induced damage. Currently-used accelerated tests are compared with those defined by measured operational data. For plastic encapsulated microcircuits, temperature-humidity-bias tests are used in component qualification. In the case of surface-mount solder joint fatigue, the IPC published a definition of the commercial airplane thermal cycle environment.; Although this is not a sufficient sample to draw general conclusions about the commercial airplane environment, it provides a more detailed view of commercial airplane environments than has ever been available. This methodology will enable equipment designs to be optimized for the real environment and improve accelerated test effectiveness, thereby reducing costs while enhancing reliability.
机译:长期以来,人们一直认为气候环境,尤其是热循环和湿度是电子设备可靠性的关键因素。大多数湿度和热循环加速测试在某种程度上是任意指定的,很少证明与使用环境有关联。这项工作提出了一种基于测量的环境数据确定实际湿度和热循环测试要求的方法。为了说明这种方法,测量了商用飞机的环境数据并将其应用于特定的故障机制。在运行飞机的关键航空电子区域,测量了超过1100次飞行的温度,相对湿度,压力和设备功率状况。故障站点的本地环境是使用瞬态假设得出的。为了将不规则的字段数据减少为可用于加速度变换的形式,提出了保留必要属性的计数算法。在不连续的湿度和温度间隔下的时间将被累积。对于热循环计数,引入了三参数雨流法,该方法保留了焊料疲劳分析所需的随时间变化的参数。将基于平均环境参数量身定制的加速测试与这些损伤整合方法进行比较。表面贴装技术和塑料封装的微电路越来越多地用于新的航空电子设计中。这些技术被用作开发现实的加速寿命测试的示例案例。现有的和计算简单的加速度变换用于估计环境引起的破坏。将当前使用的加速测试与测量的运行数据所定义的那些进行比较。对于塑料封装的微电路,在元件鉴定中使用了温度-湿度-偏压测试。对于表面贴装的焊点疲劳,IPC公布了商用飞机热循环环境的定义。尽管这不足以得出关于商用飞机环境的一般结论的样本,但它提供了比以往任何时候都更详细的商用飞机环境视图。这种方法可以使设备设计针对实际环境进行优化,并提高加速的测试效率,从而在提高可靠性的同时降低成本。

著录项

  • 作者

    Cluff, Kevin Dale.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Mechanical.; Applied Mechanics.
  • 学位 Ph.D.
  • 年度 1996
  • 页码 239 p.
  • 总页数 239
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;应用力学;
  • 关键词

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