首页> 外文学位 >Tensile superplastic behavior of YBa(2)Cu(3)O(7-x) and YBa(2)Cu(3)O(7-x)/Ag high transition temperature superconductors.
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Tensile superplastic behavior of YBa(2)Cu(3)O(7-x) and YBa(2)Cu(3)O(7-x)/Ag high transition temperature superconductors.

机译:YBa(2)Cu(3)O(7-x)和YBa(2)Cu(3)O(7-x)/ Ag高转变温度超导体的拉伸超塑性行为。

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摘要

Tensile superplasticity of YBa{dollar}sb2{dollar}Cu{dollar}sb3{dollar}O{dollar}sb{lcub}rm 7-x{rcub}{dollar} and of YBa{dollar}sb2{dollar}Cu{dollar}sb3{dollar}O{dollar}sb{lcub}rm 7-x{rcub}{dollar}/ 25 vol%Ag composites was investigated. Tensile elongations close to 100% were achieved for fine grained (0.6-0.9 {dollar}mu{dollar}m) microstructures in the temperature range of 800-875{dollar}spcirc{dollar}C, at a strain rate 6 {dollar}times{dollar} 10{dollar}sp{lcub}-6{rcub}{dollar} to 10{dollar}sp{lcub}-3{rcub}{dollar}/sec. It is suggested that the dominant superplastic deformation mechanism is grain boundary sliding, accommodated and controlled by interface reaction, characterized by a stress exponent of n = 2, a grain size exponent of p = 1.5 and an activation energy of Q{dollar}sb{lcub}rm sp{rcub}{dollar} = 515 {dollar}pm{dollar} 100kJ/mol. Superplastic deformation was accompanied by grain growth. Both static and dynamic grain growth exhibited cubic growth kinetics with apparent activation entalpies of 512 and 437 kJ/mol, respectively. These results are in accordance with the deformation results and are consistent with the apparent activation energy for self diffusivity of yttrium along grain boundaries. Addition of 25vol% silver resulted in a greater strain-to-failure. The deformation parameters of the composite were the same as those of the monolithic material, suggesting the same deformation mechanism. A weaker time dependence resulted for both static and dynamic grain growth, yielding a grain growth exponent of 4. Critical temperature T{dollar}sb{lcub}rm c{rcub}{dollar}, normal state resistivity and critical current density J{dollar}sb{lcub}rm c{rcub}{dollar} measurements showed an overall improvement in current carrying capability after deformation. As a result of grain growth and better intergrain coupling J{dollar}sb{lcub}rm c{rcub}{dollar} increased over six fold with the large strains, nevertheless remaining within typical values found for bulk materials.
机译:YBa {dollar} sb2 {dollar} Cu {dollar} sb3 {dollar} O {dollar} sb {lcub} rm 7-x {rcub} {dollar}和YBa {dollar} sb2 {dollar} Cu {dollar的拉伸超塑性研究了sb3 {dollar} O {dollar} sb {lcub} rm 7-x {rcub} {dollar} / 25 vol%Ag复合材料。在温度为800℃至875℃时,应变率为6时,细晶粒的(0.6-0.9 {μm}μm})的微结构的拉伸伸长率接近100%。次{dollar} 10 {dollar} sp {lcub} -6 {rcub} {dollar}到10 {dollar} sp {lcub} -3 {rcub} {dollar} / sec。认为主要的超塑性变形机制是晶界滑动,由界面反应调节和控制,其应力指数为n = 2,晶粒尺寸指数为p = 1.5,活化能为Q {dollar} sb { lcub} rm sp {rcub} {dollar} = 515 {dollar} pm {dollar} 100kJ / mol。超塑性变形伴随晶粒生长。静态和动态晶粒生长均表现出立方生长动力学,其表观活化焓分别为512和437 kJ / mol。这些结果与形变结果一致,并且与钇沿晶界自扩散的表观活化能一致。添加25vol%的银会导致更大的失效应变。复合材料的变形参数与整体材料相同,表明相同的变形机理。静态和动态晶粒生长的时间依赖性都较弱,晶粒生长指数为4。临界温度T {dollar} sb {lcub} rm c {rcub} {dollar},常态电阻率和临界电流密度J {dollar } sb {lcub} rm c {rcub} {dollar}测量显示出变形后电流承载能力的整体提高。由于晶粒的生长和更好的粒间耦合,大应变导致J {dollar} sb {lcub} rm c {rcub} {dollar}增加了六倍,但仍保持在散装材料的典型值范围内。

著录项

  • 作者

    Albuquerque, Jose Maria.;

  • 作者单位

    Lehigh University.;

  • 授予单位 Lehigh University.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1998
  • 页码 224 p.
  • 总页数 224
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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