Heat dissipation is one of the most critical issues in electronics due to increasing power densities. This problem is getting even worse for small and sophisticated devices. Thermal Interface Materials (TIM) placed in between heat source and heat sink plays a major role in cooling devices. The ability to work at large temperature cycling results in reduction of thermos-mechanical reliability for the traditional TIMs. A high thermal performance, cost effective and reliable TIM would be needed to dissipate the generated heat, which could enable significant reductions in weight, volume and cost of the thermal management system. The objective of this research is to design advanced TIM using graphene-metal, graphene-polymer, graphene-phase change material or nanotubes-metal composite that can outperform traditional TIMs when it is used in high heat fluxes applications including space and aero-space applications. A three dimensional computational analysis model is developed to evaluate graphene-based TIM in terms spreading of heat and reduction junction temperature using power device that uses Insulated-Gate Bipolar Transistor (IGBT) power module.
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