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Deep defects in wide bandgap materials investigated using deep level transient spectroscopy.

机译:使用深能级瞬态光谱研究宽带隙材料中的深层缺陷。

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摘要

Deep levels in GaAs, GaN, ScN and SiC, have been investigated using Deep Level Transient Spectroscopy (DLTS). Properties of deep levels, such as electronic behavior, activation energy, capture cross-section and concentration have been calculated.; In order to be able to perform DLTS measurements, Schottky or p-n junctions were fabricated from the material of interest. For this, contact formation and characterization has been studied. For each material, several types of contacts have been investigated. The contacts with the best properties in terms of leakage currents, band bending, and interface states density were used for DLTS measurements.; GaN materials have been synthesized using metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) and rf-sputtering, in an attempt to compare and correlate the existence of the B defect (activation energy of EC-ET = 0.59 eV) with the method of growth. Only material grown using MOCVD could be used for DLTS analysis.; ScN material grown using plasma assisted physical vapor deposition (PAPVD) and rf-sputtering, has been used with p-type Si to form p-n junctions. Depending upon the method of growth, different defects are found in the material. A defect with activation energy of 0.51 eV has been identified as an electron trap in the PAPVD material and one electron trap with activation energy of 0.91 eV in rf-sputtered material.; The influence of substrate annealing upon the deep levels in two SiC polytypes, 4H-n-type SiC and 6H-p-type SiC has been investigated. For each set of annealed samples, several new defects were found (activation energies of EC-ET = 0.41 eV, 0.50 eV for n-type 4H-SiC, EC-ET = 0.37 eV and 0.33 eV for p-type 6H-SiC), all of them being electron traps, with the exception of one hole trap on the 4H-SiC material (ET-EV = 0.14 eV). The activation energies range from (0.14–0.50) eV below the conduction band. The nature of five of the found defects is not clear. For all the other defects, their existence has been correlated with published studies.
机译:GaAs,GaN,ScN和SiC中的深层已使用深层瞬态光谱法(DLTS)进行了研究。计算了深层的性质,例如电子行为,活化能,捕获截面和浓度。为了能够执行DLTS测量,肖特基或p-n结由感兴趣的材料制成。为此,已经研究了接触的形成和表征。对于每种材料,已经研究了几种类型的触点。在泄漏电流,带弯曲和界面态密度方面具有最佳性能的触点用于DLTS测量。 GaN材料已通过金属有机化学气相沉积(MOCVD),分子束外延(MBE)和rf溅射合成,以试图比较和关联B缺陷的存在(E C -E T = 0.59 eV)的生长方法。仅使用MOCVD生长的材料可用于DLTS分析。使用等离子辅助物理气相沉积(PAPVD)和rf溅射生长的ScN材料已与 p 型Si一起使用,以形成 p-n 结。根据生长方法的不同,材料中会发现不同的缺陷。活化能为0.51 eV的缺陷已被识别为PAPVD材料中的电子陷阱,而rf溅射材料中的活化能为0.91 eV的一个电子陷阱。研究了衬底退火对两种SiC多型4H- n 型SiC和6H- p 型SiC深位的影响。对于每组退火样品,发现了几个新的缺陷(E C -E T 的活化能= 0.41 eV, n 的活化能为0.50 eV型4H-SiC,对于 p型 6H-SiC,E C -E T = 0.37 eV和0.33 eV)是电子陷阱,除了4H-SiC材料上的一个空穴陷阱(E T -E V = 0.14 eV)。活化能在导带以下,范围为(0.14-0.50)eV。发现的五个缺陷的性质尚不清楚。对于所有其他缺陷,它们的存在与已发表的研究相关。

著录项

  • 作者

    Perjeru, Florentina.;

  • 作者单位

    Ohio University.;

  • 授予单位 Ohio University.;
  • 学科 Physics Condensed Matter.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 219 p.
  • 总页数 219
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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