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Negative differential resistance devices and their circuit applications.

机译:负差分电阻器件及其电路应用。

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摘要

As CMOS technology advances to its physical limits of feature size shrinking, it is important to investigate technologies that employ alternative device physics and transport phenomena. Among a host of nascent technologies, resonant-tunneling diodes (RTDs) are the most mature and promising for commercial introduction for the following reasons. First, RTDs can operate at room temperature with large peak-to-valley current ratio (PVCR) which enables a large noise margin in RTD-based logic circuits. Second, RTDs can be monolithically integrated with conventional technologies such as heterojunction bipolar transistors (HBTs), and high-electron mobility transistors (HEMTs). Third, the self-latching property of RTDs makes it possible to realize complex logic functionality with a few devices (RTDs and transistors). This can have a tremendous impact on logic circuit designs and greatly increases the IC packing density.; This thesis encompasses many aspects of research on InP-based RTD-HBT circuits. Device properties were first studied in this work. The RTD characteristics can be designed by optimizing the layer structures. The fabricated RTDs showed a wide range of peak current density from 5.7 × 103 A/cm 2 to 1.27 × 105 A/cm2 on different layer structure designs. The smallest peak voltage obtained was 0.25V on the RTD with an InAs subwell design. The highest PVCR found was 30 at room temperature. The InAlAs/InGaAs material system was used for fabricating HBTs. The highest fT and fMAX obtained in this work were 60GHz and 87GHz, respectively on a 2.5 × 2.5 μm 2-HBT. A breakdown voltage greater than 5V has been obtained on the HBT with a 7500Å-thick collector. Semiconductor PIN diodes for photodetectors have also been fabricated. The measured responsivity was 0.7A/W. Si-based tunnel diodes were also studied in this work because of the possibility of integrating tunnel diodes with the CMOS process. Negative differential resistance was measured on MBE-wafers. These wafers had δ-doping planes to provide extremely high doping concentration and form triangular potential wells. These wells helped confine electrons and increase the tunneling probability. The maximum PVCR found was 1.18 at room temperature and 1.2 at 80K. The PVCR should be improved by optimizing the growth conditions.; Based on the measured device characteristics, RTD-HBT logic gates were designed and fabricated. Two different processes, the via-hole process and the air-bridge process, were developed and improved for this work. Both processes featured all wet-etching processing and self-aligned base contacts. Several digital circuits including a static inverter, concensus element, minority gate and the Monostable-Bistable transition Logic Element (MOBILE) inverting gate have been implemented with RTDs and HBTs. The logic function of these RTD-based circuits has been confirmed up to 10Gb/s which was the limit of our test instrumentation. Photoreceivers based on RTDs and PIN diodes have also been successfully fabricated and tested. Compared to a commercially available photoreceiver, the fabricated photoreceiver consumes very low power (only 0.21mW) and has a high conversion gain of 3000V/W. Optimization of the circuit design should greatly improve the sensitivity of the photoreceivers. These results indicate the potential of RTD-HBT circuits of digital gates and optical communications.
机译:随着CMOS技术发展到其特征尺寸缩小的物理极限,研究采用替代器件物理和传输现象的技术非常重要。在众多新兴技术中,谐振隧道二极管(RTD)是最成熟的技术,由于以下原因,可用于商业应用。首先,RTD可以在室温下以较大的峰谷电流比(PVCR)运行,从而在基于RTD的逻辑电路中实现较大的噪声容限。其次,RTD可以与常规技术(例如异质结双极晶体管(HBT)和高电子迁移率晶体管(HEMT))单片集成。第三,RTD的自锁特性使利用少量设备(RTD和晶体管)实现复杂的逻辑功能成为可能。这会对逻辑电路设计产生巨大影响,并大大增加IC的封装密度。本文涵盖了基于InP的RTD-HBT电路研究的许多方面。在这项工作中首先研究了器件性能。可以通过优化层结构来设计RTD特性。制成的RTD的峰值电流密度范围从5.7×10 3 A / cm 2 到1.27×10 5 A / cm < super> 2 在不同的层结构设计上。在具有InAs子阱设计的RTD上,获得的最小峰值电压为0.25V。在室温下发现的最高PVCR为30。 InAlAs / InGaAs材料系统用于制造HBT。在这项工作中获得的最高 f T f MAX 在2.5×2.5上分别为60GHz和87GHz μm 2 -HBT。使用7500Å厚的集电极在HBT上已获得大于5V的击穿电压。还制造了用于光电探测器的半导体PIN二极管。测得的响应度为0.7A / W。由于可以将隧道二极管与CMOS工艺集成在一起,因此在这项工作中还研究了基于硅的隧道二极管。在MBE晶圆上测量了负差分电阻。这些晶片具有δ掺杂平面,可提供极高的掺杂浓度并形成三角形势阱。这些阱帮助限制电子并增加隧穿概率。发现的最大PVCR在室温下为1.18,在80K下为1.2。应通过优化生长条件来改善PVCR。基于测量的器件特性,设计和制造了RTD-HBT逻辑门。为此工作开发并改进了两种不同的工艺,即通孔工艺和气桥工艺。两种工艺均具有全部湿法蚀刻工艺和自对准基极接触。 RTD和HBT已实现了几个数字电路,包括静态逆变器,共识元件,少数门和单稳态双稳态转换逻辑元件(MOBILE)反相门。这些基于RTD的电路的逻辑功能已被证实达到10Gb / s的速度,这是我们测试仪器的极限。基于RTD和PIN二极管的光接收器也已经成功制造和测试。与市售的光接收器相比,制造的光接收器功耗非常低(仅0.21mW),并且具有3000V / W的高转换增益。电路设计的优化应大大提高光接收器的灵敏度。这些结果表明了数字门和光通信RTD-HBT电路的潜力。

著录项

  • 作者

    Lin, Cheng-Hui.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 153 p.
  • 总页数 153
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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