Thin-film VCSEL and optical interconnection layer fabrications for fully embedded board level optical interconnects.

摘要

Semiconductor technology has been splendid evolved. As a consequence of, massive data traffic is required in system level. However copper based interconnection reached the upper limit of data transfer rate and can not provide enough bandwidth for high performance system. Copper based interconnection in long haul application was replaced to optical fiber. Optical interconnection in system level is generally considered as an alternative to provide high bandwidth. However, unlike long haul application, optical interconnection in system level encountered many problems such as compatibility, robustness and packaging difficulty. The compatibility to current electrical board system and packaging difficulty must be solved.; This dissertation describes a fully embedded board level optical interconnection, which can solve many problems, components fabrication and hybrid integration with electrical layers. Thin-film VCSEL array and flexible optical waveguide are demonstrated. The optical interconnection layer integrated with thin-film VCSEL and photo-detector arrays is demonstrated.