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Finishing of silicon nitride balls for advanced bearing applications by large-batch magnetic float polishing (MFP) apparatus.

机译:通过大批量磁浮抛光(MFP)设备对用于高级轴承应用的氮化硅球进行精加工。

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摘要

Scope and method of study. This investigation deals with the development of a new apparatus for finishing large diameter and large batch of silicon nitride (Si3N4) balls (46 balls of 3/4 in. diameter) for hybrid bearing applications. Three stages are involved in magnetic float polishing of ceramic balls, namely, roughing, semi-finishing, and final finishing. Abrasives such as B4C, SiC, and CeO2 are used under low polishing loads (∼1 N/ball) and high polishing speeds (∼400 rpm for a 12.2 in. diameter polishing spindle). Taguchi method was applied in the roughing stage to optimize the material removal rate. In-situ machining of the polishing spindle is found to be essential for improving the accuracy and geometric alignment of the system. During polishing the chamber can be self-aligned with the spindle.; Findings and conclusions. A groove is formed on the bevel of the spindle, which plays an important role in each stage. Initially, in the roughing stage, it is preferable, though not essential, to machine the groove in order to obtain a high material removal rate. It is, however, necessary to maintain the groove formed at the end of roughing stage in order to improve sphericity. The sphericity can be significantly improved in the semi-finishing stage by not machining the groove. In the final finishing stage, machining the groove is necessary for rapid improvement in the surface finish. A batch of 46, 3/4 in. Si3N4 balls was finished to a final diameter of 0.7500 in. with a good sphericity ∼0.25 pm and surface finish, Ra ∼8 nm in an actual polishing time of ∼24 hours. This technology is easy to implement in industry and would not require high capital investment.
机译:研究范围和方法。这项研究涉及开发一种用于精加工混合轴承应用的大直径和大批量氮化硅(Si3N4)球(46个直径为3/4英寸的球)的新设备的开发。陶瓷球的磁浮抛光涉及三个阶段,即粗加工,半精加工和最终精加工。 B4C,SiC和CeO2等磨料在低抛光负荷(〜1 N /球)和高抛光速度(对于直径为12.2英寸的抛光锭而言为〜400 rpm)下使用。在粗加工阶段采用田口方法以优化材料去除率。发现抛光主轴的原位加工对于提高系统的精度和几何对准至关重要。在抛光过程中,腔室可以与主轴自动对准。结论和结论。在主轴的斜面上形成凹槽,该凹槽在每个阶段都起着重要的作用。最初,在粗加工阶段,尽管不是必需的,但是优选对凹槽进行机加工以获得高的材料去除率。但是,必须保持在粗加工阶段结束时形成的凹槽,以改善球形度。通过不加工凹槽,可以在半精加工阶段显着改善球形度。在最后的精加工阶段,必须对凹槽进行机加工,以快速改善表面光洁度。将一批46个3/4英寸的Si3N4球精加工到最终直径为0.7500英寸,并具有约0.25 pm的良好球形度,并在约24小时的实际抛光时间内完成Ra约8 nm的表面处理。该技术易于在工业中实施,并且不需要大量的资本投资。

著录项

  • 作者

    Kirtane, Tejas S.;

  • 作者单位

    Oklahoma State University.;

  • 授予单位 Oklahoma State University.;
  • 学科 Engineering Mechanical.
  • 学位 M.S.
  • 年度 2004
  • 页码 121 p.
  • 总页数 121
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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