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Smart vision in system-on-chip applications

机译:片上系统应用中的智能视觉

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摘要

In the last decade the ability to design and manufacture integrated circuits with higher transistor densities has led to the integration of complete systems on a single silicon die. These are commonly referred to as System-on-Chip (SoC). As SoCs processes can incorporate multiple technologies it is now feasible to produce single chip camera systems with embedded image processing, known as Imager-on-Chips (IoC). The development of IoCs is complicated due to the mixture of digital and analog components and the high cost of prototyping these designs using silicon processes. There are currently no re-usable prototyping platforms that specifically address the needs of IoC development. This thesis details a new prototyping platform specifically for use in the development of low-cost mass-market IoC applications. FPGA technology was utilised to implement a frame-based processing architecture suitable for supporting a range of real-time imaging and machine vision applications. To demonstrate the effectiveness of the prototyping platform, an example object counting and highlighting application was developed and functionally verified in real-time. A high-level IoC cost model was formulated to calculate the cost of manufacturing prototyped applications as a single IoC. This highlighted the requirement for careful analysis of optical issues, embedded imager array size and the silicon process used to ensure the desired IoC unit cost was achieved. A modified version of the FPGA architecture, which would result in improving the DSP performance, is also proposed.
机译:在过去的十年中,设计和制造具有更高晶体管密度的集成电路的能力已导致将整个系统集成在单个硅芯片上。这些通常称为片上系统(SoC)。由于SoC流程可以采用多种技术,因此现在可以生产具有嵌入式图像处理功能的单芯片相机系统,即所谓的“芯片上成像器(IoC)”。由于数字和模拟组件的混合以及使用硅工艺对这些设计进行原型制作的高昂成本,IoC的开发非常复杂。当前,没有专门用于满足IoC开发需求的可重用原型平台。本文详细介绍了一个新的原型平台,该平台专门用于开发低成本大众市场IoC应用程序。利用FPGA技术来实现基于帧的处理架构,该架构适用于支持一系列实时成像和机器视觉应用。为了演示原型平台的有效性,开发了一个示例对象计数和突出显示应用程序,并进行了功能实时验证。制定了高级IoC成本模型,以将制造原型应用程序的成本计算为单个IoC。这突出了对光学问题,嵌入式成像器阵列尺寸和用于确保实现所需IoC单位成本的硅工艺进行仔细分析的要求。还提出了FPGA体系结构的修改版本,它将改善DSP性能。

著录项

  • 作者

    Wells, Cade Cenric.;

  • 作者单位

    University of Glasgow (United Kingdom).;

  • 授予单位 University of Glasgow (United Kingdom).;
  • 学科 Electrical engineering.
  • 学位 Eng.D.
  • 年度 2005
  • 页码 229 p.
  • 总页数 229
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 海洋工程;
  • 关键词

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