首页> 外文学位 >Design and manufacturing of loop heat pipes for electronics cooling.
【24h】

Design and manufacturing of loop heat pipes for electronics cooling.

机译:设计和制造用于电子冷却的回路热管。

获取原文
获取原文并翻译 | 示例

摘要

A loop heat pipe (LHP) is a two-phase heat transfer device that uses the latent heat of vaporization of a working fluid for heat transfer. Due to their inherent robustness, LHPs are ideal candidates to meet the ever increasing thermal challenges facing the electronics and spacecraft industries. Through miniaturization, LHPs have the potential to efficiently transport, spread, and dissipate heat in advanced electronics packages where the heat dissipation is rapidly increasing with decreasing volume.; In this study, three LHPs were designed, manufactured, and tested to help gain the knowledge necessary for developing smaller and more efficient designs for use in future Canadian space missions. A detailed development process was discussed and included initial design criteria and selection, material preparation and treatment, assembly, evacuation, charging, and sealing. A series of tests were conducted to investigate the thermal performance characteristics of each unit. Tests were performed under ambient conditions to study the effect of fluid inventory on LHP start-up, steady-state operating temperature, effective thermal resistance, and overall heat transfer coefficient. Alternate configurations were investigated to measure the effect of orientation and periodic heating on thermal performance. LHP operation was also examined for temperature hysteresis during rapid power variations.; Numerical models were developed to aid in the design phase of the study by estimating the properties of various working fluids, calculating fluid inventory, and sizing the compensation chamber. The models also provide the foundation for future work on a 1-D steady state solver to predict operational characteristics such as steady-state temperatures, system pressure drop and mass flow rate for any given design.
机译:回路热管(LHP)是两相传热设备,它使用工作流体的汽化潜热进行传热。由于其固有的坚固性,LHP是应对电子和航天器行业日益增长的热挑战的理想选择。通过小型化,LHP有潜力在先进的电子封装中有效地传输,散布和散发热量,这些电子封装的散热随着体积的减小而迅速增加。在这项研究中,设计,制造和测试了三个LHP,以帮助获得开发更小,更高效的设计以供将来加拿大航天任务使用所需的知识。讨论了详细的开发过程,包括初始设计标准和选择,材料准备和处理,组装,疏散,装料和密封。进行了一系列测试以研究每个单元的热性能特征。在环境条件下进行了测试,以研究流体库存对LHP启动,稳态工作温度,有效热阻和总传热系数的影响。研究了替代配置,以测量取向和周期性加热对热性能的影响。还检查了LHP操作在功率快速变化期间的温度滞后。通过估计各种工作流体的特性,计算流体存量并确定补偿室的尺寸,开发了数值模型以帮助研究的设计阶段。这些模型还为将来在一维稳态求解器上的工作奠定了基础,以预测任何给定设计的运行特性,例如稳态温度,系统压降和质量流量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号