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Fabrication and Characterization of Hafnium Oxide Based Resistive Random Access Memory Devices.

机译:基于氧化Ha的电阻式随机存取存储器件的制造与表征。

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摘要

Current technology is dependent on the usage of a memory hierarchy. Primary components include SRAM, DRAM, and Flash. The ordering of these components in the memory hierarchy is dictated by both the cost and the performance of the components. These devices all share two distinct problems in that they are all charge based memories containing at least one transistor. Scaling of transistors with accordance to Moore's law is becoming even more difficult as we stretch the limitations of lithography. A universal memory component could simplify the memory hierarchy and allow for even higher levels of performance. Resistive Random Access Memory (ReRAM) is a leading candidate to be the first universal memory. As a two-terminal device with 3D capability, DRAM-like latency, and non-volatile storage, it essentially meets the requirements. Higher endurance and higher yield are the two most pressing needs in terms of performance. However, our understanding of these devices is severely lacking.;This dissertation presents characterization on three different HfO 2-based ReRAM devices. Devices showed promising results, particularly when the device area was scaled down. ReRAM switching was shown to be filamentary due to the non-dependency on the device area. A one-time forming step is required to achieve switching characteristics. A compliance current was necessary during forming to contain the conductance of the filament. An enlarged filament would require even higher reset current, which is generally dictated by the compliance current. Parasitics can affect the on-state resistance due to an inability to control the maximum current through the ReRAM device. Alternative forming techniques such as slow forming and multi-step forming can be used to avoid this effect. Joule heating was shown to be the catalyst to reset the device, which was a polarity dependent process. Devices showed a gradual reset trend, which was both temperature dependent and time dependent. Resetting devices at cryogenic temperatures with fast pulses showed insufficient reset, this can be understood by the temperature dependency in LRS. This work illustrates some unique testing to demonstrate the working principals of ReRAM devices. Further understanding of ReRAM devices is necessary to fully understand the working mechanism.
机译:当前的技术取决于存储器层次结构的使用。主要组件包括SRAM,DRAM和闪存。这些组件在内存层次结构中的顺序由组件的成本和性能决定。这些器件都具有两个明显的问题,因为它们都是包含至少一个晶体管的基于电荷的存储器。随着我们扩展光刻的局限性,按照摩尔定律缩放晶体管变得更加困难。通用内存组件可以简化内存层次结构,并提供更高的性能水平。电阻式随机存取存储器(ReRAM)是第一个通用存储器的领先候选者。作为具有3D功能,类似于DRAM的延迟和非易失性存储的两终端设备,它基本上可以满足要求。就性能而言,更高的耐久性和更高的产量是两个最紧迫的需求。然而,我们对这些器件的认识却十分缺乏。;本文对三种不同的基于HfO 2的ReRAM器件进行了表征。器件显示出令人鼓舞的结果,尤其是在缩小器件面积时。由于不依赖于设备区域,因此ReRAM切换显示为丝状。需要一次成型步骤以实现开关特性。在成型过程中必须有一个顺从电流来控制细丝的电导。增大的灯丝将需要更高的复位电流,这通常由顺从电流决定。由于无法控制流过ReRAM器件的最大电流,寄生效应会影响导通状态电阻。诸如慢速成型和多步成型的替代成型技术可以用来避免这种影响。焦耳加热被证明是使装置复位的催化剂,这是极性依赖的过程。器件显示出逐渐复位的趋势,该趋势既取决于温度又取决于时间。用快速脉冲在低温温度下复位设备显示复位不足,这可以通过LRS中的温度依赖性来理解。这项工作说明了一些独特的测试,以演示ReRAM设备的工作原理。为了充分了解工作机制,有必要进一步了解ReRAM设备。

著录项

  • 作者

    Long, Branden Michael.;

  • 作者单位

    The University of Toledo.;

  • 授予单位 The University of Toledo.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2013
  • 页码 266 p.
  • 总页数 266
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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