首页> 外文学位 >Challenges in nanometre digital integrated circuit design.
【24h】

Challenges in nanometre digital integrated circuit design.

机译:纳米数字集成电路设计的挑战。

获取原文
获取原文并翻译 | 示例

摘要

Technology trends, driven by the desire for higher transistor densities and faster devices, have led to transistor dimensions scaling into the nanometre regime. However, with this continued scaling, digital Integrated Circuits (ICs) have faced many challenges that include: increased leakage power dissipation, increased process variations of transistor parameters and increased sensitivity of ICs to ionizing radiation from terrestrial and cosmic sources. These challenges are having a significant effect on circuit performance and power, making it more difficult to design circuits that achieve a required specification. This thesis presents new techniques for addressing these challenges in digital circuits.; First, a new Static Random Access Memory (SRAM) cell is presented that reduces gate leakage power in caches while maintaining low access latency and stability. The new cell design, compared to a conventional SRAM cell, has one additional transistor and exploits the strong bias towards logic-0 at the bit, level exhibited by the memory value stream of ordinary programs. Then, techniques for reducing leakage power in Field-Programmable-Gate-Array (FPGA) routing switches and look-up tables are presented; the new circuits significantly reduce the leakage power in those circuits with varying amounts of area and/or performance cost.; Next, circuit and architectural techniques that reduce the Soft-Error-Rate (SER) in a Content-Addressable Memory (CAM) are presented; the first technique augments a Ternary-CAM cell with extra transistors to make it more immune to soft errors, and the second technique, applicable to Binary-CAM cells, adds parity bits to each CAM word and then modifies the sensing scheme so that both a match and a one-bit miss constitute a successful search. The main cost of both of these schemes is increased area.; Then a scheme to compensate for Within-Die (WID) variations in domino logic is presented; the new technique reduces the variation in leakage, delay and noise margin with a small area overhead. Finally a new methodology which takes into consideration the effect of WID process variations on a low-voltage parallel system is presented. The new methodology shows that in the presence of process variations one should use a higher supply voltage than would otherwise be predicted to minimize the power consumption of a parallel system.
机译:对更高晶体管密度和更快器件的需求推动了技术趋势,导致晶体管尺寸扩展到纳米范围。然而,随着这种不断扩展,数字集成电路(IC)面临许多挑战,包括:泄漏功率耗散增加,晶体管参数的工艺变化增加以及IC对来自地面和宇宙源的电离辐射的敏感性增加。这些挑战对电路性能和功率产生了重大影响,使得设计达到所需规格的电路更加困难。本文提出了解决数字电路中这些挑战的新技术。首先,提出了一种新的静态随机存取存储器(SRAM)单元,该单元可降低高速缓存中的门泄漏功率,同时保持较低的访问延迟和稳定性。与传统的SRAM单元相比,新的单元设计具有一个附加晶体管,并利用了普通程序的存储值流所显示的位向逻辑0的强偏置。然后,提出了降低现场可编程门阵列(FPGA)路由交换机和查找表中的泄漏功率的技术。新电路以不同的面积和/或性能成本显着降低了这些电路中的泄漏功率。接下来,提出了减少内容可寻址存储器(CAM)中的软错误率(SER)的电路和体系结构技术。第一种技术是使用额外的晶体管来增强三元CAM单元,使其对软错误更加免疫,第二种技术适用于二进制CAM单元,将奇偶校验位添加到每个CAM字,然后修改感测方案,以便匹配和一位未命中构成成功的搜索。这两种方案的主要成本都是增加面积。然后提出了一种补偿多米诺逻辑中芯片内(WID)变化的方案。新技术以较小的面积开销减少了泄漏,延迟和噪声容限的变化。最后,提出了一种新方法,该方法考虑了WID工艺变化对低压并联系统的影响。新的方法论表明,在存在工艺变化的情况下,应使用比预期的更高的电源电压,以最大程度地降低并行系统的功耗。

著录项

  • 作者

    Azizi, Navid.;

  • 作者单位

    University of Toronto (Canada).;

  • 授予单位 University of Toronto (Canada).;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 183 p.
  • 总页数 183
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号