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Aluminum Gallium nitride / Gallium nitride CAVETs for high power switching application.

机译:铝氮化镓/氮化镓CAVET用于大功率开关应用。

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摘要

GaN-based power electronics are rapidly developing as a contender for application in next generation high efficiency power electronics. They are either lateral devices like HEMTs or vertical devices of the form of the Current Aperture Vertical Electron Transistor (CAVET). A CAVET is a vertical device with source and gate on top and a current aperture that allows current to flow vertically down from the source to the drain. It has a current blocking layer (CBL) to block current flowing vertically through any other path but the aperture. Lateral devices have been and still continue to be the center of attention in the AlGaN/GaN based device structures owing to the horizontal nature of the 2DEG. In power integrated circuits, there is frequently a need for several power devices to be formed on a single chip. One such application is an H-bridge driver circuit for motor control. In order to reduce the cost and increase the yield of an integrated circuit having multiple power devices, the size of each power device must be minimized.;The size of a power device is dictated mainly by the need for a given low onresistance (Ron). The minimum on-resistance per unit area is normally associated with a vertical device, as opposed to a lateral device. In such devices, the gate and source are formed on a semiconductor surface and the drain contact is located at the bottom of the chip. Hence, the substrate acts as the drain. Higher current can be obtained per unit chip area in a vertical topology. Further, the drain contact is at the bottom in the vertical transistors and the metal scheme required to handle high currents is simplified. The availability of high quality, low-defect density bulk GaN material triggered the work done in this thesis, where it was shown that the structure can hold up to 100V/mum which is comparable or higher than a lateral device. From the demonstration of AlGaN/GaN CAVET on conductive GaN substrate to achieving dispersion less (gate pulsed with 80 mus pulse width) CAVET with less than 2.5mO-cm2 forms the framework of this study. This work was to explore the power handling capability of AlGaN/GaN system in its vertical mode of operation. Finding a good current blocking material and determining the most effective device dimensions forms the backbone of this work. As this thesis is being written, GaN vertical devices are attracting attention of power electronics research where higher efficiency and smaller chip area take it all.
机译:GaN基电力电子器件正迅速发展成为下一代高效电力电子器件中的竞争者。它们既可以是HEMT之类的横向器件,也可以是电流孔径垂直电子晶体管(CAVET)形式的垂直器件。 CAVET是一种垂直器件,其源极和栅极位于顶部,电流孔径使电流从源极垂直向下流至漏极。它具有电流阻挡层(CBL),用于阻挡垂直通过孔以外的任何其他路径的电流。由于2DEG的水平特性,在基于AlGaN / GaN的器件结构中,横向器件一直并将继续成为关注的焦点。在功率集成电路中,经常需要在单个芯片上形成几个功率器件。一种这样的应用是用于电动机控制的H桥驱动器电路。为了降低成本并提高具有多个功率器件的集成电路的产量,必须使每个功率器件的尺寸最小化。功率器件的尺寸主要取决于对给定的低导通电阻(Ron)的要求。 。与横向设备相反,每单位面积的最小导通电阻通常与垂直设备相关。在这样的器件中,栅极和源极形成在半导体表面上,而漏极触点位于芯片的底部。因此,基板充当漏极。在垂直拓扑中,每单位芯片面积可以获得更高的电流。此外,漏极接点位于垂直晶体管的底部,简化了处理大电流所需的金属方案。高质量,低缺陷密度的块状GaN材料的出现触发了本论文的工作,结果表明该结构可以保持高达100V / mum的电压,可与横向器件相比或更高。从在导电GaN衬底上演示AlGaN / GaN CAVET到实现更少的色散(以80 mus脉冲宽度的门脉冲),小于2.5mO-cm2的CAVET成为本研究的框架。这项工作旨在探索AlGaN / GaN系统在垂直操作模式下的功率处理能力。寻找一种良好的电流阻挡材料并确定最有效的器件尺寸是这项工作的基础。在撰写本文时,GaN垂直器件已吸引了功率电子学研究的关注,在这些领域中,更高的效率和更小的芯片面积将其全部吸收。

著录项

  • 作者

    Chowdhury, Srabanti.;

  • 作者单位

    University of California, Santa Barbara.;

  • 授予单位 University of California, Santa Barbara.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 196 p.
  • 总页数 196
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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