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Thermal Stress Fracture of Optical Glasses.

机译:光学玻璃的热应力断裂。

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摘要

Since glass is brittle and thermally insulating, significant thermal stresses, especially in larger components often lead to catastrophic failure. My work combines experimental measurement of glass thermomechanical failure, as well as computational simulations of transient thermal stresses arising in precision optical components used in fusion research. For the experimental work, I have quenched our samples and correlated the critical temperature difference for thermal shock with surface finish. I have estimated the heat transfer coefficient and the depth of the strength controlling cracks on the edge of disk samples. I have also carried out ring -on-ring biaxial strength tests to measure strength degradation of BK7 disks after thermal shock. For the simulation work, I have calculated thermal stress using both fin approximation and finite element analysis of quenched BK7 disks. The effect of cooling fluid has been examined. To examine the effects of size and glass properties, the radiative cooling processes of BK7 and LHG8 plates are also discussed. I have compared the temperature and thermal stress evolution of BK7 and LHG8 glass plates. Crack size evolution and crack growth rate have been computed. I have used three approaches to describe crack growth: the strength approach, the fracture toughness approach and the slow crack growth approach. The effect of linear variation of surrounding temperature and mitigation strategy are discussed. In this study I also examine in detail the effects of crack geometry near an edge. In addition, I have examined the thermal stresses induced by rinsing. Rinsing is a configuration in-between thermal shock and slow heating/cooling. The effects of rinsing parameters have also been investigated, especially as they affect surface tensile stresses.;The main conclusions are the critical temperature drop for catastrophic failure is in the range 124 - 140 °C for surface prepared by lapping with alumina abrasives ranging in size from 5 mum to 40 mum. Samples with finer surface finish have better thermal shock resistance. There is no obvious strength degradation for BK7 glass disks and the retained strength depends on surface finish. Thermal shock tests in silicone oil show there is significant difference for retained strength after soaking in silicone oil which is evidence of chemical effect. The simulation results of radiative cooling process of BK7 and LHG8 glass show that BK7 plate is stronger than LHG8 plate and the maximum thermal stress occurs at the center of long edge. In addition, linear variation of ambient temperature with time is more detrimental than exponential decay. The mitigation strategy shows two conductive layers work best to reduce the maximum thermal stresses. Slow crack growth approach is used to calculate the crack size evolution. Stress intensity factor of three dimensional corner cracks is simulated and arbitrary crack shape is included. My results show that even though initial crack fronts may have different length scales, the stress intensity factor is largest at the shorter length scale. The implication is that an edge crack eventually will grow to a quarter circular crack shape. Piranha rinsing process is simulated and compared with Piranha rinsing. Thermal stress follows temperature profile with delay. According to my simulation results water rinsing is more detrimental than Piranha rinsing.
机译:由于玻璃是脆性的并且是绝热的,因此很大的热应力,特别是在较大的部件中,通常会导致灾难性的故障。我的工作结合了玻璃热机械故障的实验测量以及融合研究中使用的精密光学组件中产生的瞬态热应力的计算模拟。对于实验工作,我已经淬火了样品,并将热冲击的临界温差与表面光洁度相关联。我已经估算了圆盘样品边缘的传热系数和强度控制裂纹的深度。我还进行了环对环双轴强度测试,以测量热冲击后BK7磁盘的强度下降。对于仿真工作,我已经使用鳍近似和淬火BK7磁盘的有限元分析来计算热应力。已经检查了冷却液的作用。为了检查尺寸和玻璃性能的影响,还讨论了BK7和LHG8板的辐射冷却过程。我比较了BK7和LHG8玻璃板的温度和热应力演变。计算出裂纹尺寸和裂纹扩展速率。我使用三种方法描述裂纹扩展:强度方法,断裂韧性方法和缓慢裂纹扩展方法。讨论了周围温度线性变化的影响和缓解策略。在这项研究中,我还将详细研究边缘附近的裂纹几何形状的影响。另外,我检查了漂洗引起的热应力。冲洗是介于热冲击和缓慢加热/冷却之间的配置。还研究了漂洗参数的影响,尤其是当漂洗参数影响表面拉应力时;主要结论是,通过用大小不等的氧化铝研磨剂研磨制备的表面,灾难性破坏的临界温度降在124-140°C范围内从5妈妈到40妈妈表面光洁度更高的样品具有更好的抗热震性。 BK7玻璃盘的强度没有明显下降,并且保留的强度取决于表面光洁度。在硅油中进行的热冲击试验表明,浸泡在硅油中后,保留强度存在显着差异,这是化学作用的证据。对BK7和LHG8玻璃的辐射冷却过程的仿真结果表明,BK7板比LHG8板更坚固,并且最大的热应力出现在长边的中心。另外,环境温度随时间的线性变化比指数衰减更有害。缓解策略表明,两个导电层在减小最大热应力方面效果最佳。缓慢的裂纹扩展方法用于计算裂纹尺寸的演变。模拟了三维角裂纹的应力强度因子,并包括任意裂纹形状。我的结果表明,即使初始裂纹前沿可能具有不同的长度尺度,应力强度因子在较短的长度尺度下也是最大的。这意味着边缘裂纹最终将增长到四分之一圆形裂纹形状。模拟食人鱼漂洗过程并将其与食人鱼漂洗进行比较。热应力会随温度变化而延迟。根据我的模拟结果,水冲洗比食人鱼冲洗更具危害性。

著录项

  • 作者

    Liu, Han.;

  • 作者单位

    University of Rochester.;

  • 授予单位 University of Rochester.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 205 p.
  • 总页数 205
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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