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Vapor phase deposition of self-assembled monolayers as a resist for area selective atomic layer deposition.

机译:自组装单分子层的气相沉积,作为区域选择性原子层沉积的抗蚀剂。

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Atomic layer deposition (ALD) is gaining attention as a promising method for depositing high quality, conformal, ultra thin films used in the fabrication of advanced microelectronic devices. Atomic layer deposition relies upon self-terminating surface reactions that limit the growth in most cases to no more than one atomic layer at a time. Since the ALD process is very sensitive to surface characteristics, by modifying the substrate, we can achieve patterned deposition of thin films that can be useful for semiconductor processing. The ability to perform area selective ALD would provide a number of benefits such as a reduction in the cost and number of process steps required for pattern-wise deposition of materials, elimination of possible substrate and device damage induced by the traditional etching of thin films, and the ability to directly pattern materials that are difficult to etch. We have explored the possibility of using vapor phased deposited self-assembled monolayers as a blocking layer to develop area selective atomic layer deposition techniques (AS-ALD).; We have modified Si surfaces with several types of alkoxy- or chlorosilane-based monolayers which have different head groups and backbone chain lengths. We have varied several reaction parameters such as temperature, pressure and trace amount of water to optimize each self-assembled monolayer forming process. After completing the optimization of vapor delivered SAMs to get ordered hydrophobic surfaces, area-selectivity of modified samples towards ALD was investigated by X-ray photoelectron spectroscopy. We found that deposition of HfO 2 and Pt can be blocked effectively, achieved by deactivation of SiO 2 substrates by attaching octadecyltrichlosilane (ODTS) through vapor phase deposition over 2 day's silylation exposure. Also, we have successfully blocked the ALD process by several other organic molecules adsorbed on the surfaces.; To investigate the characteristics of self-assembled monolayers by the vapor delivery method in more detail, several analytical techniques including, ellipsometry, water contact angle analysis, and multiple internal reflection Fourier transform infrared (MIR-FTIR) spectroscopy have been used. We found that to block the substrate from the ALD precursors, a well ordered, densely packed structure is necessary.
机译:原子层沉积(ALD)作为一种有前途的沉积高级微电子器件制造中使用的高质量,保形,超薄膜的方法而受到关注。原子层沉积依赖于自终止表面反应,该反应在大多数情况下一次只能限制一个原子层的生长。由于ALD工艺对表面特性非常敏感,因此通过修改基板,我们可以实现薄膜的图案化沉积,这对半导体加工很有用。执行区域选择性ALD的能力将带来许多好处,例如降低材料的图案沉积所需的成本和工艺步骤数量,消除传统的薄膜蚀刻所引起的可能的衬底损坏和器件损坏,以及直接图案化难以蚀刻的材料的能力。我们已经探索了使用气相沉积的自组装单层作为阻挡层来开发区域选择性原子层沉积技术(AS-ALD)的可能性。我们用几种具有不同头部和主链长度的烷氧基或氯硅烷基单层改性了Si表面。我们已经改变了几个反应参数,例如温度,压力和痕量水,以优化每个自组装单层形成工艺。在完成蒸汽输送SAM的优化以获得疏水表面后,通过X射线光电子能谱研究了改性样品对ALD的区域选择性。我们发现HfO 2和Pt的沉积可以有效地被阻止,这是通过在两天的甲硅烷基化暴露中通过气相沉积通过附着十八烷基富硅烷(ODTS)来使SiO 2衬底失活来实现的。同样,我们已经成功地通过吸附在表面上的其他几种有机分子阻止了ALD过程。为了更详细地研究通过蒸气输送法自组装的单分子膜的特性,已使用了多种分析技术,包括椭圆光度法,水接触角分析和多重内反射傅里叶变换红外光谱(MIR-FTIR)。我们发现,要从ALD前驱物阻止基材,必须有序有序,紧密堆积的结构。

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