PRECISION GRINDING OF SILICON

摘要

It has been found in this study that by proper setting of the grinding conditions massive ductile streaks can be achieved on precision ground surfaces of hard and brittle materials. Ductile-streaked surface is desirable to reduce polishing time and improve the surface quality. In this investigation surface roughness as low as 43nm has been obtained. It has also been found that the main effects of all the grinding parameters on surface roughness used in this study exhibit non-linear relationship. Strong interaction was found to exist between DOC and feed rate. Second order model has been established for the roughness in terms of the grinding parameters. The model is capable of navigating the design space.