DETECTION OF ORIENTATION-DEPENDENT, SINGLE-CRYSTAL DIAMOND TOOL EDGE WEAR USING CUTTING FORCE SENSORS, WHILE SPIN-TURNING SILICON

摘要

The purpose of this project is to experimentally determine the benefits of spin-turning infrared materials known to cause relatively rapid wear of single-crystal, synthetic diamond cutting tools. The testing explores the specific issues of non-uniform workpiece properties (single crystal silicon), non-uniform cutting tool properties, and machining parameters. This work includes a description of a precision spindle-based tool holder that provides high stiffness and accurate rotation for turning optical-grade surfaces.rnPrecision diamond turning of infrared crystals such as silicon is based on the theory that ductile regime machining requires very shallow depths of cut [1, 2]. However, it may be possible to remove material faster and with improved surface finish if compression-strain heating and high pressure phase transformation phenomena are recognized and developed as part of the machining process [3].