A MATHEMATICAL MODEL OF PATTERN DEPENDENCIES IN Cu CMP PROCESSES

摘要

In our previous work, we discussed the framework of a mathematical model of pattern dependencies in Cu CMP processes (1). In this paper, we present the detailed formulation of the model, propose a calibration methodology for the model, and show the first comparisons with experimental data. Our model may also be applicable to other dual material processes such as tungsten CMP, aluminum CMP, or STI CMP.