A Model of Stacked Polishing Pad for 3-D CMP Simulation

机译：用于3-D CMP仿真的堆叠式抛光垫模型

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This paper proposes a model of stacked polishing pad for three-dimensional CMP simulation based on the boundary element method (BEM). This model uses only physical properties and dimensional values and it allows us to describe and predict the behavior of stacked polishing pad for CMP.

机译：本文提出了一种基于边界元方法的三维CMP模拟的堆叠抛光垫模型。该模型仅使用物理特性和尺寸值，它使我们能够描述和预测CMP的堆叠抛光垫的行为。

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来源
《Third International Symposium on Chemical Mechanical Planarization(CMP) in Integrated Circuit(IC) Device Manufacturing, 3rd, Oct 20-22, 1999, Honolulu, Hawaii》|1999年|p.625-633|共9页
会议地点 Honolulu HI(US);Honolulu HI(US)
作者
Takafumi Yoshida;
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作者单位

Thin Film Division, Process Development Department, Nippon Foundry Inc. 1580 Yamamoto, Tateyama-shi, Chiba 294-8502, Japan;

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会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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A Model of Stacked Polishing Pad for 3-D CMP Simulation

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