Cu CMP ON ORBITAL TOOL: PHILOSOPHY, CONCEPTS AND IMPLEMENTATION

摘要

Dual Damascene Cu (Cu2D) is increasingly becoming the process of choice for IC technology. It will use Cu for both plugs and wiring. The Cu2D manufacturing sequence includes multiple use of CMP for both dielectric planarization and for shaping plugs/wires, thereby making CMP an enabling operation. Orbital polishing is known as an effective metal-CMP technique. The advantages of orbital CMP include high material removal uniformity (@3 mm EE from film edge), planarization efficiency, high throughput, small footprint, and low cost of ownership. This paper discusses objectives, philosophy and concepts of Cu CMP and summarizes SpeedFam-IPEC's experience in Cu CMP R&D with orbital planarizers (AvantGaard 676 and 776).