首页> 外文会议>Symposium on Thermoelectric Materials 2001―Research and Applications, Nov 26-29, 2001, Boston, Massachusetts, U.S.A. >THERMODYNAMIC CALCULATIONS IN NEW THERMOELECTRIC MATERIALS. APPLICATION TO PROCESSES
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THERMODYNAMIC CALCULATIONS IN NEW THERMOELECTRIC MATERIALS. APPLICATION TO PROCESSES

机译:新热电材料中的热力学计算。在过程中的应用

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摘要

The processing of electronic materials and devices is an important field of application of thermodynamics. Many growth processes of semi-conductors involve vapour-solid or liquid-solid interfaces which can be considered close to the thermodynamic equilibrium. Performance enhancement of thermoelectric modules can be obtained by a good knowledge of the constitution of the materials involved in their fabrication. Its requires a relevant thermodynamic analysis of the material.Making these optimized thermoelectric materials require at least three elements being thermoelectric materials typically multicomponent systems which are usually studied by a CALPHAD analysis of the relevant systems. All these problems are related to the thermodynamic quantities of species involved in the materials such as activities and free energy functions of electrons, holes and components. In this paper we present a contribution to a better understanding of antimony based thermoelectric materials by a CALPHAD approach.
机译:电子材料和设备的加工是热力学应用的重要领域。半导体的许多生长过程都涉及蒸气-固体或液体-固体界面,可以认为它们接近热力学平衡。热电模块的性能增强可以通过对涉及其制造的材料的构造的充分了解而获得。这需要对材料进行相关的热力学分析。制造这些优化的热电材料至少需要三个元素,即热电材料,通常是多组分系统,通常通过相关系统的CALPHAD分析进行研究。所有这些问题都与材料中涉及的物质的热力学量有关,例如电子,空穴和组分的活度和自由能函数。在本文中,我们为通过CALPHAD方法更好地理解基于锑的热电材料做出了贡献。

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