首页> 外文会议>Symposium on Semiconductor Process and Device Performance Modelling held December 2-3, 1997, Boston, Massachusetts, U.S.A. >A theoretical study on the fundamental chemical reactions in titanium plasma-enhanced cvd
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A theoretical study on the fundamental chemical reactions in titanium plasma-enhanced cvd

机译:钛等离子体增强CVD中基本化学反应的理论研究

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The important intermediates in the Ti plasma-enhanced CVD using TiCl_4/Ar/H_2 are investigated by ab initio molecular orbital (MO) calculations. From the experimental point of view, it is pointed out that TiCl_3 is a key species for the Ti deposition reaction. So, its reactivity with the Si and SiO_2 substrates is estimated theoretically from the stabilization energy. The difference of the stabilization energies of TiCl_3 between them, which is 12.3kcal/mol in Hartree-Fock level calculations with using the on-top deposition reacton model, indicates a longer existing time by the factor of 10~2 on SiO_2 than on Si. In addition to these calculations, the stabilization energies on the silicide substrates are also calculated and compared with the results on the Si and SiO_2 substrates. But other reaction paths may have to be considered because the growth rates of Ti thin films onto between Si and SiO_2 don't necessarily coincide with the tendency of calculated results.
机译:通过从头算分子轨道(MO)计算研究了使用TiCl_4 / Ar / H_2的Ti等离子体增强CVD中的重要中间体。从实验的角度出发,指出TiCl_3是Ti沉积反应的关键物质。因此,从稳定能理论上估计了它与Si和SiO_2衬底的反应性。 TiCl_3的稳定能之间的差异,在使用顶置沉积反应模型的Hartree-Fock能级计算中为12.3kcal / mol,表明SiO_2上的存在​​时间比Si上的存在时间长10〜2倍。 。除了这些计算之外,还计算了硅化物衬底上的稳定能,并将其与Si和SiO_2衬底上的结果进行了比较。但是可能必须考虑其他反应路径,因为Ti薄膜在Si和SiO_2之间的生长速率不一定与计算结果的趋势一致。

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