Analysis of the Interfacial Reaction between Sn-3.5Ag and Electroplating Interlayers

摘要

At present, Pb-free process is imperative in the electronic packaging industry. Many reports focus on Pb-free solder to improve the solderability, it seems not obtain wettability as good as SnPb solder. In this study, an alloy interlayer with different content was deposited on Cu to balance wettability and diffusion barrier in the interface of joint by electroplating process. There are three types of interlayers including Cu, Ni, and SnNi alloy. The interlayer may react with Sn-3.5Ag solder during reflow process. Sn-Ni alloy plating layer is selected to improve wettability and provide diffusion barrier at the same time in soldering process. For interfacial microstructure examination, morphology characterization can be obtained by using scanning electron microscope (SEM) and energy-dispersive x-ray analysis (EDX). The structure of IMC is identified by x-ray diffraction (XRD).