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Rapid Prototyping of Ceramic Based Photonic Bandgap Structures

机译:陶瓷基光子带隙结构的快速原型

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摘要

A three-dimensional photonic bandgap (PBG) structure was fabricated from CAD models using a method based on lost wax rapid prototyping and ceramic gelcasting. The inverse PBG mold was constructed from a low melting point thermoplastic using a high precision Sanders Rapid Toolmaker. An aqueous stable slurry (200-300 cp) containing 50-75wt% of the ceramic powders (BaSrTiO_3, MgO), a 15wt% solution of monomer (Methacylamide) and crosslinker (Poly(ethylene glycol) dimethacrylate), and a free radical initiator (2,2'Azobis(2-amidino-propane) dihydrochloride) was cast into the mold. A polymerization reaction was thermally activated at 50℃ to immobilize the ceramic powders. The wax mold was then removed by drying the green body in a high humidity oven at 120℃. Scanning Electron Microscopy (SEM) of the unfired part showed that atmosphere hampered the polymerization reaction at the surface of the part. The green density, sintered density, and permittivity all increased as the solids loading increased. In order to optimize the dielectric properties and minimize cracking and warping in the sintered part, the solids loading had to be greater than 80 wt%. This study investigated several steps in the lost mold / gelcasting procedure including stabilizing the ceramic suspension, the correlation between the solids loading and the green and sintered densities, binder removal, and the effect of shrinkage during sintering on the net shape.
机译:利用基于失蜡快速成型和陶瓷凝胶浇铸的方法,从CAD模型中制作了三维光子带隙(PBG)结构。反向PBG模具是使用高精度Sanders Rapid Toolmaker由低熔点热塑性塑料制成的。含水稳定浆液(200-300 cp),其中包含50-75wt%的陶瓷粉末(BaSrTiO_3,MgO),15wt%的单体(甲酰胺)和交联剂(聚乙二醇二甲基丙烯酸酯)溶液和自由基引发剂将(2,2'偶氮双(2-ami基丙烷)二盐酸盐)浇铸到模具中。在50℃下热活化聚合反应以固定陶瓷粉末。然后通过将生坯在高湿度烘箱中于120℃下干燥来除去蜡模。未烧制部件的扫描电子显微镜(SEM)显示,气氛阻碍了部件表面的聚合反应。生坯密度,烧结密度和介电常数均随固体含量的增加而增加。为了优化介电性能并使烧结部件中的龟裂和翘曲最小化,固体负载量必须大于80 wt%。这项研究调查了失模/浇铸过程中的几个步骤,包括稳定陶瓷悬浮液,固体载荷与生坯和烧结密度之间的相关性,粘结剂的去除以及烧结过程中收缩率对最终形状的影响。

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