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The Dynamics of Cadmium Telluride Etching

机译:碲化镉蚀刻的动力学

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摘要

CdTe etching was investigated using variable angle spectroscopic ellipsometry and glancing angle x-ray diffraction. Treatment with HNO_3:H_3PO_4 (NP) based etches was shown to form amorphous-Te surface films which spontaneously crystallize following etching. Br_2/methanol (BM) etching forms very thin amorphous-Te films. NP-etched surfaces are stable in ambient air for ~1 hr before beginning to oxidize, while BM etched films oxidize immediately following treatment. CdTe grain boundary etching by NP was minimized using more acidic etches. Device analysis suggests that a higher Te content produces more stable back contacts by attenuating Cu diffusion. Mechanistic details of NP etching are discussed.
机译:使用变角光谱椭圆偏光法和掠射角X射线衍射研究了CdTe蚀刻。显示出用基于HNO_3:H_3PO_4(NP)的蚀刻进行的处理形成了非晶态的Te表面膜,该表面膜在蚀刻后自然结晶。 Br_2 /甲醇(BM)蚀刻形成非常薄的非晶Te膜。在开始氧化之前,NP蚀刻的表面在环境空气中稳定约1个小时,而BM蚀刻的膜在处理后立即被氧化。通过使用更多的酸性刻蚀,可以最大程度地减少NP对CdTe晶界的腐蚀。器件分析表明,较高的Te含量会通过减弱Cu扩散而产生更稳定的背接触。讨论了NP蚀刻的机械细节。

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