首页> 外文会议>Symposium on Advanced Interconnects and Contacts held April 5-7, 1999,San Francisco, California, U.S.A. >Diffusion barriers for copper metallization: predicting phase stability and reactivity using equilibrium thermodynamics
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Diffusion barriers for copper metallization: predicting phase stability and reactivity using equilibrium thermodynamics

机译:铜金属化的扩散壁垒:使用平衡热力学预测相稳定性和反应性

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摘要

The guidelines for designing a conductive, amorphous material, capable of thermodynamic equilibrium with copper, are defined using readily available thermodynamic information. The tradeoff between desired properties- equilibrium at the interfaces, amorphous microstructure, and electronic conductivity - are described, along with trends i relevant binary systems that result in these properties. These guidelines defined systems for experimental study, for which preliminary results are presented.
机译:使用容易获得的热力学信息定义了设计能够与铜进行热力学平衡的导电无定形材料的准则。描述了所需特性之间的权衡,包括界面处的平衡,非晶态微结构和电导率,以及导致这些特性的相关二元系统的趋势。这些指导方针定义了用于实验研究的系统,并给出了初步结果。

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