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Minimise PCB emissions through simulation-based optimisation of termination

机译:通过基于仿真的端接优化将PCB排放降至最低

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Reducing the emissions in order to meet the various regulatory standards is often unnecessarily painful. Due to the complex nature of electromagnetic interactions, locating the exact path that the emissions should take to exit the enclosure is difficult. This paper presents the methods of minimizing the PCB emissions through the simulation-based optimization of terminations. The details of the parallel, series, and diode termination strategies were discussed. Significant reductions in the final EMI emissions are obtained through the reduction of the high frequency content of the common-mode currents and the harmonic-frequency amplitude of international trace currents. These reductions are obtained at no cost since the cost of a resistor in not based on an ohmic value.
机译:减少排放量以满足各种法规标准通常是不必要的痛苦。由于电磁相互作用的复杂性,很难确定排放物应采取的确切路径以离开外壳。本文介绍了通过基于端子的仿真优化来最小化PCB排放的方法。讨论了并联,串联和二极管端接策略的细节。通过降低共模电流的高频含量和国际走线电流的谐波频率幅度,可以显着降低最终的EMI辐射。这些降低是免费获得的,因为电阻器的成本不基于欧姆值。

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