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Analysis of Intrinsic and Parasitic Gate Delay of InGaAs HEMTs

机译:InGaAs HEMT的本征和寄生门延迟分析

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摘要

In this paper, the principles, measurement techniques, and analysis of the gate delay of high-electron-mobility-transistors (HEMTs) mainly based on an InP material system are discussed. In the measurement techniques, de-embedding of the pad parasitics is also described. The intrinsic part of the gate delay of HEMTs is the transit time for electrons to travel in the gate depletion region. When the gate length is large enough, the intrinsic gate delay is dominant in the total gate delay. However, as the gate length becomes less than 100 nm, the delay analysis reveals that the intrinsic gate delay is now no longer dominant but the parasitic gate delay ascribed to the resistance and capacitance out of the gate region. Based on these results, ways for further improvement of the frequency response are also discussed.
机译:本文讨论了主要基于InP材料系统的高电子迁移率晶体管(HEMT)的原理,测量技术以及栅极延迟分析。在测量技术中,还描述了焊盘寄生的去嵌入。 HEMT的栅极延迟的本质部分是电子在栅极耗尽区中传播的传播时间。当栅极长度足够大时,固有栅极延迟在总栅极延迟中占主导地位。然而,随着栅极长度变得小于100 nm,延迟分析表明,本征栅极延迟现在不再占主导地位,而寄生栅极延迟则归因于栅极区域之外的电阻和电容。基于这些结果,还讨论了进一步改善频率响应的方法。

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