首页> 外文会议>Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International >280GHz and 860GHz image sensors using Schottky-barrier diodes in 0.13μm digital CMOS
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280GHz and 860GHz image sensors using Schottky-barrier diodes in 0.13μm digital CMOS

机译:在0.13μm数字CMOS中使用肖特基势垒二极管的280GHz和860GHz图像传感器

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Millimeter and sub-millimeter-wave imaging using solid-state circuits is gaining attention for security and medical applications. To lower cost and increase integration, MOSFETs in CMOS are being investigated for implementing broadband detectors [1-3]. However, neither measured noise-equivalent power (NEP) nor noise floor of the imager was given in [1]. Although NEP of 17pW/Hz1/2 was achieved at 650GHz in [2], an external lens was attached to the 65nm SOI CMOS chip. In [3], an NEP of 66pW/Hz1/2 was measured at 1.05THz using 65nm CMOS without a lens attached to the chip. Additionally, although the efforts reported in [1-3] realized an array, none demonstrated the image-array function. As an alternative, polysilicon-gate-separation (PGS) Schottky-barrier diodes (SBD) with cut-off frequency of ~2THz were fabricated in CMOS without process modifications [4] and were used to demonstrate a 280GHz detector with NEP of 30pW/Hz1/2 [5,6]. To significantly enhance the scanning speed, a 16-pixel 280GHz SBD imager is fabricated and its array function is reported in this paper. The imager including baseband amplifiers achieves responsivity of 5.1kV/W and NEP of 29pW/Hz1/2. More importantly, its operation was demonstrated in a setup that requires no mirror or lens that is bulky and costly. Next, an 860GHz SBD detector is demonstrated with a measured non-amplified responsivity of 355V/W and NEP of 32pW/Hz1/2. This NEP is ~2X lower than the best reported work in CMOS [3]. Both chips are fabricated in a 0.13μm logic CMOS. The results suggest a path for high performance, compact and affordable sub-millimeter-wave and terahertz CMOS imagers using SBDs.
机译:使用固态电路的毫米波和亚毫米波成像在安全和医疗应用中正受到关注。为了降低成本并提高集成度,正在研究CMOS中的MOSFET以实现宽带检测器[1-3]。但是,在[1]中既没有给出测得的噪声等效功率(NEP),也没有给出成像仪的本底噪声。尽管在[2]中在650GHz时达到了17pW / Hz 1/2 的NEP,但在65nm SOI CMOS芯片上安装了一个外部透镜。在[3]中,使用65nm CMOS且未在芯片上安装透镜,在1.05THz下测得的NEP为66pW / Hz 1/2 。另外,尽管[1-3]中报道的努力实现了阵列,但是没有一个展示出图像阵列功能。另外,截止频率约为2THz的多晶硅栅分离(PGS)肖特基势垒二极管(SBD)是在CMOS上制造的,无需进行工艺修改[4],并用于演示280 GHz检测器,NEP为30pW / Hz 1/2 [5,6]。为了显着提高扫描速度,制造了一个16像素280GHz SBD成像器,并报道了其阵列功能。包括基带放大器的成像仪可实现5.1kV / W的响应度和29pW / Hz 1/2 的NEP。更重要的是,在无需笨重且昂贵的镜子或镜头的设置中证明了其操作。接下来,展示了一个860GHz SBD检测器,其测得的非放大响应率为355V / W,NEP为32pW / Hz 1/2 。这个NEP比CMOS上最好的报道要低2倍[3]。两种芯片均采用0.13μm逻辑CMOS制成。结果为使用SBD的高性能,紧凑且价格合理的亚毫米波和太赫兹CMOS成像器开辟了道路。

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