首页> 外文会议>Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International >A 0.5V 4Mb logic-process compatible embedded resistive RAM (ReRAM) in 65nm CMOS using low-voltage current-mode sensing scheme with 45ns random read time
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A 0.5V 4Mb logic-process compatible embedded resistive RAM (ReRAM) in 65nm CMOS using low-voltage current-mode sensing scheme with 45ns random read time

机译:采用65ns CMOS的0.5V 4Mb逻辑过程兼容嵌入式电阻RAM(ReRAM),采用低压电流模式感应方案,随机读取时间为45ns

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Numerous low-supply-voltage (VDD) mobile chips, such as energy-harvesting-powered devices and biomedical applications, require low-VDD on-chip nonvolatile memory (NVM) for low-power active-mode access and power-off data storage. However, conventional NVMs cannot achieve low-VDD operation due to insufficient write voltage generated by charge-pumped (CP) circuits at a low VDD, and a lack of low-VDD current-mode sense amplifiers (CSA) [1-4] to overcome read issues in reduced sensing margins, degraded speeds, and insufficient voltage headroom (VHR). Resistive RAM (ReRAM) [4-6] is a promising memory with the advantages of short write time, low write-voltage, and reduced write power compared to Flash and other NVMs. Using a low-VDD CP with relaxed output voltage/current requirements for write operations, ReRAM is a good candidate for on-chip low-VDD NVM if a low-VDD CSA is provided, particularly for frequent-read-seldom-write applications. We develop a body-drain-driven CSA (BDD-CSA) with dynamic BL bias voltage (VBL) and small VHR for larger sensing margins to achieve a lower VDDmin, faster read speed, and better tolerance of read cell current (ICELL) and BL leakage current (IBL-LEAK) variations compared to conventional CSAs. A fabricated 65nm 4Mb ReRAM macro using the BDD-CSA and our CMOS-logic-compatible ReRAM cell [7] achieves 0.5V VDDmin. The BDD-CSA achieves 0.32V VDDmin.
机译:许多低电源(V DD )移动芯片,例如能量收集供电的设备和生物医学应用,都需要低V DD 片上非易失性存储器( NVM)用于低功耗有源模式访问和断电数据存储。但是,传统的NVM由于低V DD 的电荷泵(CP)电路生成的写入电压不足而缺乏低电压,因此无法实现低V DD 操作-V DD 电流模式感测放大器(CSA)[1-4]可以解决以下问题:降低感测裕度,降低速度以及降低电压裕量(VHR)。电阻RAM(ReRAM)[4-6]是一种很有前途的存储器,与闪存和其他NVM相比,其具有写入时间短,写入电压低和写入功率降低的优点。 ReRAM使用低V DD CP且对写操作具有宽松的输出电压/电流要求,因此,ReRAM是片上低V DD NVM的理想选择。提供了V DD CSA,尤其是对于频繁读写的应用程序。我们开发了具有动态BL偏置电压(V BL )和小VHR的体漏驱动CSA(BDD-CSA),以实现更大的感测裕度,从而实现更低的V DDmin 与传统CSA相比,读取速度更快,读取单元电流(I CELL )和BL漏电流(I BL-LEAK )变化的耐受性更好。使用BDD-CSA和我们的CMOS逻辑兼容的ReRAM单元制造的65nm 4Mb ReRAM宏可实现0.5V V DDmin 。 BDD-CSA达到0.32V V DDmin

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