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SOME PRACTICAL EXAMPLES OF DIAMOND MICROELECTROMECHANICAL STRUCTURES (DMEMS)

机译:金刚石微机电结构(DMEMS)的一些实际示例

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摘要

CVD (chemically vapor deposited) diamond films are processed similar to "conventional" semiconductor device fabrication to achieve diamond micro-electromechanical structures (DMEMS). An attractive feature of these diamond films is their ability to be an excellent dielectric (undoped, resistivity > 10~(14) ohm-cm to > 400℃) or an interesting semiconductor/conductor (doped, resistivity ~ < 1 to 1 Kohm-cm). Sequential microelectronic processing has been combined with CVD diamond technology to arrive at a "wafer fabrication" approach to achieve diamond pressure sensors and accelerometers that can perform in extreme conditions. This paper will review the design and behavior of the next generation DMEMS devices for extreme conditions and will describe the behavior of a diamond emission triode.
机译:类似于“常规”半导体器件制造过程,对CVD(化学气相沉积)金刚石膜进行处理,以实现金刚石微机电结构(DMEMS)。这些金刚石薄膜的一个吸引人的特征是它们具有出色的介电性能(无掺杂,电阻率> 10〜(14)ohm-cm至> 400℃)或令人感兴趣的半导体/导体(掺杂的电阻率〜<1至1 Kohm-厘米)。顺序微电子处理已与CVD金刚石技术相结合,以实现“晶圆制造”方法,以实现可在极端条件下运行的金刚石压力传感器和加速度计。本文将回顾下一代DMEMS器件在极端条件下的设计和性能,并描述金刚石发射三极管的性能。

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