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ECC Is Ready for RFID - A Proof in Silicon

机译:ECC已做好RFID的准备-硅的证明

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摘要

This paper presents the silicon chip ECCon, an Elliptic Curve Cryptography processor for application in Radio-Frequency Identification. The circuit is fabricated on a 180 nm CMOS technology. EC-Con features small silicon size (15K GE) and has low power consumption (8.57 μW). It computes 163-bit ECC point-multiplications in 296k cycles and has an ISO 18000-3 RFID interface. ECCon's very low and nearly constant power consumption makes it the first ECC chip that can be powered passively. This major breakthrough is possible because of a radical change in hardware architecture. The ECCon datapath operates on 16-bit words, which is similar to ECC instruction-set extensions. A number of innovations on the algorithmic and on the architectural level substantially increased the efficiency of 163-bit ECC. ECCon is the first demonstration that the proof of origin via electronic signatures can be realized on RFID tags in 180 nm CMOS and below.
机译:本文介绍了硅芯片ECCon,一种用于无线电频率识别的椭圆曲线密码学处理器。该电路是在180 nm CMOS技术上制造的。 EC-Con具有小硅片尺寸(15K GE)和低功耗(8.57μW)。它以296k个周期计算163位ECC点乘法,并具有ISO 18000-3 RFID接口。 ECCon的极低功耗和几乎恒定的功耗使其成为首款可被动供电的ECC芯片。由于硬件体系结构的根本变化,因此可能取得重大突破。 ECCon数据路径对16位字进行操作,这与ECC指令集扩展类似。在算法和体系结构级别上的许多创新大大提高了163位ECC的效率。 ECCon是第一个演示,它可以在180 nm CMOS及以下的RFID标签上实现通过电子签名进行的原产地证明。

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