Thin film stress and texture analysis at the MCX synchrotron radiation beamline at ELETTRA

摘要

The main instrumental characteristics of MCX, the new beamline at the Italian synchrotron Elettra in Trieste, are presented. Design and geometrical set-up are well suited to the X-ray diffraction stress and texture analysis of thin films and surfaces, and are such to guarantee a full control of the main instrumental errors. Besides exploiting the typical features of synchrotron radiation, like high brilliance, tuneable beam energy and optimal beam geometry, MCX can also host tools for in-situ studies, like X-ray diffraction during four point bending. A few examples of current applications are shown.