首页> 外文会议>Real-Time Systems, 2009. ECRTS '09 >Leakage Aware Feasibility Analysis for Temperature-Constrained Hard Real-Time Periodic Tasks
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Leakage Aware Feasibility Analysis for Temperature-Constrained Hard Real-Time Periodic Tasks

机译:温度受限的硬实时周期性任务的泄漏感知可行性分析

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As semiconductor technology continues to evolve, the chip temperature increases rapidly due to the exponentially growing power consumption. In the meantime, the high chip temperature increases the leakage power, which is becoming the dominate part in the overall power consumption for sub-micron IC circuits. A power/thermal-aware computing technique becomes ineffective if this temperature/leakage relation is not properly addressed in the sub-micron domain. In this paper, we study the feasibility problem for scheduling a hard real-time periodic task set under the peak temperature constraint, with the interaction between temperature and leakage being taken into consideration. Three analysis techniques are developed to guarantee the schedulability of periodic real-time task sets under the maximal temperature constraint. Our experiments, based on technical parameters from a processor using the 65 nm technology, show that the feasibility analysis without considering the interactions between temperature and leakage can be significantly overoptimistic.
机译:随着半导体技术的不断发展,由于功耗呈指数增长,芯片温度迅速升高。同时,较高的芯片温度增加了泄漏功率,这已成为亚微米IC电路总功耗中的主要部分。如果此温度/泄漏关系在亚微米域中未得到适当解决,则功率/热感知计算技术将失效。在本文中,我们研究了在峰值温度约束下调度硬实时任务集的可行性问题,同时考虑了温度与泄漏之间的相互作用。开发了三种分析技术来保证在最大温度约束下周期性实时任务集的可调度性。我们的实验基于使用65 nm技术的处理器的技术参数,表明在不考虑温度与泄漏之间相互作用的情况下进行可行性分析可能会过于乐观。

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