首页> 外文会议>Pulsed Power Conference (PPC), 2011 IEEE >Ceramic packaging reliability study of a 13.5 kV multichip thyristor
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Ceramic packaging reliability study of a 13.5 kV multichip thyristor

机译:13.5 kV多芯片晶闸管的陶瓷封装可靠性研究

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We present our work on the reliability of the new ceramic housing of our 13.5 kV multichip thyristor. First ceramic versions manifested terrible failure after only a few shots under a bias voltage of 10 kV and a peak current of 110 kA in the best case. This problem has been solved and the newer ceramic-housing version is now fully commercialized under the model number 5SPB36Z1350. This product version completes successfully a stress test of 200 shots under previous conditions without failing. Moreover, no aging behavior has been detected.
机译:我们介绍了有关13.5 kV多芯片晶闸管新型陶瓷外壳可靠性的工作。在最佳情况下,第一个陶瓷版本在10 kV偏置电压和110 kA峰值电流下仅击中几下,就表现出严重的故障。这个问题已经解决,较新的陶瓷外壳版本现已完全商业化,型号为5SPB36Z1350。该产品版本在以前的条件下成功完成了200次枪击的压力测试,而且没有失败。此外,未检测到老化行为。

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