首页> 外文会议>Proceedings of the technical program, SMTA International 2009 >PRINTED CIRCUIT BOARD TECHNOLOGIES FOR THE REALIZATION OF STRETCHABLE ELECTRONIC SYSTEMS
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PRINTED CIRCUIT BOARD TECHNOLOGIES FOR THE REALIZATION OF STRETCHABLE ELECTRONIC SYSTEMS

机译:用于实现可拉伸电子系统的印刷电路板技术

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In an increasing number of novel electronic applicationsrnthe ability of an electronic system to comply with arncertain degree of elongation is requested. Suchrnelongations may either be a single stretching during thernfabrication process, or the system may be subjected tornrepeated stretch and release cycles. Different technicalrnapproaches to add elasticity to electronic circuitries havernbeen developed and investigated during recent years. Inrnthe present paper a short overview of these technologiesrnwill be given. One particular technology will be treated inrnmore detail, which makes use of conventional fabricationrntechnologies for printed circuit boards. The nonconventionalrnbuilding blocks of the realized stretchablerncircuit boards are (i) the stretchable matrix material,rnthermoplastic polyurethane, and (ii) meandering copperrnconductors between electronic components. With minorrnsupport measures such boards can be handled and treatedrnlike rigid printed circuit boards throughout the fabricationrnprocess. For component assembly onto the stretchablerncircuits again conventional process technology applies:rnsolder printing, pick and place, reflow. The onlyrnconstraint -due to the physical properties of the stretchablernmatrix- is the use of a low temperature solder alloy likernSnBi and the respectively low reflow temperature. Afterrnassembly the components are usually encapsulated withrnpolyurethane. So far a number of stretchable electronicrnapplications have been realized. The examples which willrnbe presented in the present paper are a band aid withrnembedded sensors and a control unit and the integration ofrnstretchable systems into textiles
机译:在越来越多的新颖电子应用中,要求电子系统符合确定的伸长度的能力。这样的伸长可以是在制造过程中的一次拉伸,或者可以对该系统进行重复的拉伸和释放循环。近年来,已经开发出并研究了各种增加电子电路弹性的技术方法。在本文中,将简要概述这些技术。将更详细地对待一种特定技术,该技术利用了用于印刷电路板的常规制造技术。已实现的可拉伸电路板的非常规构造块是(i)可拉伸基质材料,热塑性聚氨酯,以及(ii)在电子组件之间弯曲铜导体。通过较小的支撑措施,可以在整个制造过程中像处理硬质印刷电路板一样处理和处理此类板。对于将组件组装到可拉伸电路上,再次采用传统的工艺技术:焊料印刷,拾取和放置,回流。由于可拉伸矩阵的物理特性,唯一的限制是使用低温焊接合金,如rnSnBi和相应的低回流温度。组装后,通常将组件用聚氨酯封装。到目前为止,已经实现了许多可伸缩的电子应用。本文将介绍的示例是带嵌入式传感器和控制单元的创可贴,以及将可拉伸系统集成到纺织品中

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