首页> 外文会议>Proceedings of International Kunming Symposium on Microscopy July 2-5, 2000 Kunming, Yunnan Province, China >Investigation of grain boundaries and interfaces in thin films of metal oxide electronic materials by means of HRTEM - A key link of interface engineering in electronic application
【24h】

Investigation of grain boundaries and interfaces in thin films of metal oxide electronic materials by means of HRTEM - A key link of interface engineering in electronic application

机译:用HRTEM研究金属氧化物电子材料薄膜中的晶界和界面-电子应用中界面工程的关键环节。

获取原文
获取原文并翻译 | 示例

摘要

In many cases, the grain boundaries and interfaces are the key elements in electroceramics-based devices and determine the behavior of the electronic devices. In order to obtain the desired properties of the devices engineering of grain boundaries and interfaces is necessary. This needs the knowledge of the structural and chemical details of the interfaces and grain boundaries.
机译:在许多情况下,晶界和界面是基于电陶瓷的设备中的关键元素,并决定了电子设备的行为。为了获得所需的器件性能,需要对晶界和界面进行工程设计。这需要了解界面和晶界的结构和化学细节。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号