首页> 外文会议>Proceedings of China display / Asia display 2011 >Passivation Roles of Hydrogen Plasma Radicals on Crystallized Poly-Si
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Passivation Roles of Hydrogen Plasma Radicals on Crystallized Poly-Si

机译:氢等离子体自由基在结晶多晶硅上的钝化作用

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A post passivation method with H-plasma for crystallized poly-Si film was proposed and its mechanism was studied. Using H-plasma treatment will shorten the passivation time to 10-30 minutes instead of ten hours. In virtue of detecting the on-line optical emission spectroscopy (OES) during post Hplasma passivation and combined them with the measured Hall mobility, Raman spectra and absorption coefficient spectra the roles of H plasma radicals have been investigated. We have found that the intensity of different hydrogen plasma radicals along time for different crystallized poly-Si film material shows different actions during post H-plasma passivation. Radical Hαwith lower energy is mainly responsible for passivating the poly-Si crystallized by SPC which crystallization precursor was made by PECVD. Higher energy radicals H* may passivate the defects related to Ni impurity around the grain boundaries more effectively. In addition, the highest energy radicals Hβ and Hγ are needed to passivate intra-grain defects as in the poly-Si crystallized also by SPC but which precursor was made by LPCVD. It is strongly proofed that the Hplasma radicals and the passivation time needed for optimal passivation are related with the kind of crystallized poly-Si film material. At the end an optimization condition for each kind of crystallized poly-Si materials has been discussed.
机译:提出了一种用H-等离子体后钝化结晶多晶硅薄膜的方法,并研究了其机理。使用H-等离子体处理会将钝化时间从10小时缩短到10-30分钟。借助于在后等离子体钝化过程中检测在线光学发射光谱(OES)并将其与测得的霍尔迁移率,拉曼光谱和吸收系数谱结合,研究了H等离子体自由基的作用。我们已经发现,对于不同的结晶的多晶硅膜材料,随着时间的推移,不同氢等离子体自由基的强度在后H-等离子体钝化期间显示出不同的作用。具有较低能量的自由基Hα主要用于钝化通过SPC结晶的多晶硅,该SPC是通过PECVD制备的结晶前体。较高的能量自由基H *可以更有效地钝化与晶界周围的Ni杂质有关的缺陷。另外,与通过SPC结晶的多晶硅一样,钝化晶粒内缺陷也需要最高的能量自由基Hβ和Hγ,而前者是通过LPCVD制造的。有力的证明,最佳钝化所需的Hplasma自由基和钝化时间与结晶的多晶硅膜材料的种类有关。最后讨论了每种结晶多晶硅材料的优化条件。

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