THERMAL PERFORMANCE OF HIGH-EFFICIENCY HEAT DISSIPATION DEVICE USING VAPOR CHAMBER TYPE HEAT PIPE FOR SHIPS AND OFFSHORE PLANTS

摘要

High-power light emitting diodes (LEDs), a strong candidate for the next generation illumination applications, are of interest.Because of the LEDs have many advantages such power saving long life compared with traditional incandescent bulb and they do not contain filament.Especially, it has attracted the attention of the shipbuilding industries.But there are few problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin.In order to solve these problems, we use vapor chamber type heat pipe.Optimal quantity of state was R-141b 35％ charging ratio.Experimental result, LED chip temperature were maintained below 100.0℃.This study is to evaluate thermal characteristics of LED indoor lighting system using vapor chamber type heat pipe for ship and offshore plants.