首页> 外文会议>Proceeding of the 1995 IEEE 5th international conference on conduction and breakdown in solid dielectrics >Electrical breakdown of rare earth oxide insulator thin films in silicon MIS structures
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Electrical breakdown of rare earth oxide insulator thin films in silicon MIS structures

机译:硅MIS结构中稀土氧化物绝缘体薄膜的电击穿

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The present experimental results on the electrical breakdown of REO thin films of thickness 0,025 ÷ 0,23 μm show the high electrical strength of these films.rnThe stage of the critical charge accumulation in REO thin films precedes the stage of the intrinsic breakdown.rnThe observed films were demonstrated to be perspective for the device and integrated circuit application as insulator layers.
机译:目前对厚度为0.025÷0.23μm的REO薄膜进行电击穿的实验结果表明,这些薄膜具有很高的电强度.rn REO薄膜中的临界电荷积累阶段先于本征击穿阶段.rn薄膜被证明是器件和集成电路应用的绝缘层的透视图。

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