Assessment of temperature influence on partial discharges in epoxy/mica insulation

摘要

The influence of temperature in epoxy/mica insulation system on the partial discharges (PD) parameters was examined. Particularly the changes of 3D PD patterns were observed when the temperature rised up to 135℃. Possible causes of these changes are discussed taking into account different kinds of PD sources. The thermal stress influences the PD mechanism and accelerates the degrading process in insulation. This synergistic effect appears already in initial stage of PD acting. The increase of PD pulses magnitude and the PD number is observed. The resulting transition of PD patterns is analyzed.